Product Name | AMAOE Huawei Hi3690 5G lower layer reballing stencil 0.12MM CPU steel mesh |
Item NO. | 1317125 |
Smart device Brand | Android, Huawei |
BGA reballing kit | Stencil |
Weight | 0.04 kg = 0.0882 lb = 1.4110 oz |
Category | Phone repair tools > BGA reballing kit |
Tag | CPU Stencil , HI , CPU steel mesh , Huawei stencil , HI stencil , 0.12mm stencil , 0.12mm , Huawei CPU stencil , AMAOE CPU stencil , 0.12mm CPU stencil , AMAOE 0.12MM stencil , Hi3690 , Hi3690 stencil , 3690 , Hi3690 5G , Hi3690 5G stencil |
Brand | AMAOE |
Creation Time | 2020-06-19 |
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