Product Name | AMAOE Redmi K30Pro motherboard middle layer tin planting kit K3P-012 stencil position plate magnetic base |
Item NO. | 1316130 |
Smart device Brand | Android, XiaoMi |
BGA reballing kit | Stencil, Tin planting platform |
Weight | 0.55 kg = 1.2125 lb = 19.4007 oz |
Category | Phone repair tools > BGA reballing kit |
Tag | Base , Mi stencil , Redmi stencil , Xiaomi stencil , 0.12mm stencil , Magnetic base , position plate , middle layer stencil , Redmi K30Pro , Redmi K30Pro stencil , K3P-012 , K3P , positioning plate , K30Pro |
Brand | AMAOE |
Creation Time | 2020-06-18 |
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